An alleged image of the iPhone 18 Pro motherboard has leaked, revealing the A20 Pro chip using new Wafer-Level Multi-Chip Module (WMCM) packaging technology. This new architecture moves DRAM to the side of the package, reducing thermal coupling and improving heat dissipation. The design will feature LPDDR6 memory with a 96-bit bus for more energy-efficient bandwidth. While the overall chip size is similar to the A19 Pro, the Neural Processing Unit (NPU) is notably larger, indicating a focus on enhanced AI performance. The A20 Pro chip is also expected to utilize TSMC's 2nm process (N2), potentially offering up to 15 percent faster performance and 30 percent greater efficiency compared to A19 chips. N2 further incorporates super-high-performance metal-insulator-metal (SHPMIM) capacitors, doubling capacitance density and improving power delivery. These combined advancements in WMCM and N2 are anticipated to globally boost performance, power stability, and energy efficiency. The leak, though unconfirmed, aligns with previous rumors about WMCM technology for the iPhone 18 Pro. The iPhone 18 Pro, iPhone 18 Pro Max, and foldable iPhone models are expected to share this A20 Pro chip. These "Pro" and "Fold" models are also anticipated to share 12GB RAM, 48-megapixel rear cameras, and Apple's C2 modem. All three models are expected to be released in September this year.