Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as "panel-level", to meet rising demand for powerful AI chips (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia: Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as “panel-level”, to meet rising demand for powerful AI chips  —  TAIPEI — Taiwan Semiconductor Manufacturing Co. is close to finalizing the specifications for a radically new approach …