TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reportedly reserved most of the capacity (Katie Tarasov/CNBC)

Katie Tarasov / CNBC: TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reportedly reserved most of the capacity  —  An underappreciated step in the chipmaking process is poised to become the next bottleneck for artificial intelligence.